报告题目：Narrow Bandgap Semiconductors for infrared applications
报 告 人：Dr. Wen Lei（The University of Western Australia）
报告时间：2024年6月20日（周四）下午15:00
报告地点：新葡萄8883官网AMG新楼D503报告厅
报告摘要：
Narrow bandgap HgCdTe-based infrared sensors have dominated the high-performance end of infrared sensing and imaging market for decades due to their unbeatable device performance. However, the further development of infrared applications requires the sensors to have new features of lower cost, larger array size, higher operation temperature, larger field of view, higher object-identification accuracy, and multiband detection, which presents big challenges to the current infrared sensor technology. In this presentation, I will introduce our status and future directions at UWA (University of Western Australia) in developing advanced HgCdTe infrared sensors for next generation infrared applications. GaSb alternative substrate, novel “nBn” device architecture, curved focal plane array, polarization-selective sensors and adaptive focal plane array were proposed to meet the requirements of next generation infrared sensors. Apart from our classical HgCdTe sensor technology, I will also introduce some of our recent effort on exploring nanostructure-based infrared sensors, including Bi2X3, Sb2X3, and Ag2X (X=Te, Se and S) topological insulator-based narrow bandgap semiconductors. Infrared sensor applications of these nanostructure-based single layer and heterostructures will be discussed, including their passive imaging and cavity-enhanced polarization selection. I will also discuss the future development of nanostructure-based infrared sensors from the perspective of practical industry applications.
报告人简介：
Dr. Wen Lei is a Professor, an ARC Future Fellow, the Program Chair of Electrical and Electronic Engineering, and the Chair of the IEEE Western Australia Joint ESP Chapter (Electron Devices Society, Solid State Circuits Society, and Photonics Society), and leads the Electronic Materials and Devices Research at the Department of Electrical, Electronic and Computer Engineering, University of Western Australia. His current research mainly focuses on semiconductor materials, devices and their system applications especially infrared sensors. He was awarded his prestigious ARC Future Fellowship in 2013. He holds 2 patents, and has published 3 book chapters (Springer publishing), 3 invited topical review articles, and over 130 high profile papers in top journals like Applied Physics Reviews, Physical Review Letters, Advanced Materials, Advanced Functional Materials, Nano Letters, Small, Advanced Optical Materials, IEEE Transactions on VLSI Systems, and Applied Physics Letters, etc. He was awarded the “2019 Best Paper of the Year Award for the Journal - IEEE Transactions on Very Large Scale Integration Systems”, and the “Best Paper Award for 2019 IEEE International Conference on Artificial Intelligence Circuits and Systems”. He is also an associate editor/editorial board member of five international journals, a member of Scientific Advisory Board/Technical Program Committee/Organizing Committee for several international conferences and a regular reviewer for various international prestigious journals and funding agencies.
邀 请 人：何军 教授
